Substrate treatment device, substrate treatment method, and substrate treatment program

Provided is a substrate treatment device provided with a control unit for controlling the treatment of a substrate in accordance with a treatment procedure set in a process recipe, wherein the process recipe is linked to a plurality of partial recipes obtained by unitizing the treatment procedure by...

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Bibliographische Detailangaben
Hauptverfasser:	ONO, KAZUMUNE, SASAKI, MITSURU, KITAHARA, RYU, MIURA, TATSUYA, OHNO, TOSHIHIRO, ENDO, SHOKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a substrate treatment device provided with a control unit for controlling the treatment of a substrate in accordance with a treatment procedure set in a process recipe, wherein the process recipe is linked to a plurality of partial recipes obtained by unitizing the treatment procedure by function, and the control unit controls the treatment of the substrate in accordance with treatment procedures set in the linked plurality of partial recipes.