Pressure sensitive adhesive compositions and masking articles

Some embodiments herein are related to pressure sensitive adhesive compositions and articles such as adhesive tapes. In some embodiments, the adhesive tape includes a backing and a first pressure sensitive adhesive composition disposed on at least a portion of a first side of the backing. The first...

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Bibliographische Detailangaben
Hauptverfasser:	SHERIDAN, MARGARET MARY, PURGETT, MARK DODD, LESUFFLEUR, MARIE ALOSHYNA EP, FORNEY, BRADLEY STEVEN, BOLTON, JUSTIN MICHAEL, LEHMANN, MEGAN POIRIER, RUNGE, MICHAEL BRETT
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Some embodiments herein are related to pressure sensitive adhesive compositions and articles such as adhesive tapes. In some embodiments, the adhesive tape includes a backing and a first pressure sensitive adhesive composition disposed on at least a portion of a first side of the backing. The first pressure sensitive adhesive composition can include one or more hydrocarbon block copolymers and a polar phenolic tackifier comprising a phenolic moiety and having a hydroxyl value of between 20 to 130 and an acid value of less than 0.5. Some embodiments relate to adhesive compositions including one or more hydrocarbon block copolymers and a polar phenolic tackifier comprising a phenolic moiety and having a hydroxyl value of between 20 to 130 and an acid value of less than 0.5. Some embodiments relate to a method of making an adhesive article is included. In some embodiments, methods of using an adhesive article is included.