Method of manufacturing electronic package module and electronic package module manufactured by the same
A method of manufacturing electronic package module is provided. The method performs metal compartment by metal dam and filling process so as to protect electronic element from electromagnetic influence in concert with metal coating.
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | A method of manufacturing electronic package module is provided. The method performs metal compartment by metal dam and filling process so as to protect electronic element from electromagnetic influence in concert with metal coating. |
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