Radiation-sensitive resin composition, cured film, and its formation method, and the display device

Excellent radiation sensitivity and storage stability, chemical resistance, pattern adhesion after development, exposure pulling pattern adhesion after every, and radiation-sensitive resin composition of the cured film can be formed with excellent transparency, the radiation-sensitive resin cured fi...

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Bibliographische Detailangaben
1. Verfasser:	NARUKO, AKITO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Excellent radiation sensitivity and storage stability, chemical resistance, pattern adhesion after development, exposure pulling pattern adhesion after every, and radiation-sensitive resin composition of the cured film can be formed with excellent transparency, the radiation-sensitive resin cured film formed from the composition, the method of forming the cured film, and it is an object to provide a display device including the cured film. The present invention, [A] the same or different in the polymer, the polymer component containing a structural unit having the structural unit and a crosslinking group having a group represented by formula (1), and [B] Equation (2) is a radiation-sensitive resin composition containing a radiation-sensitive acid generator comprising at least one compound and N- sulfonyloxyimide compound having an oxime sulfonate group represented by.