Semiconductor chip and method for producing a semiconductor chip
A semiconductor chip (10) is specified which is, in particular, an optoelectronic semiconductor chip which has a structured substrate (30), which at a surface (31) has a structure of depressions (32) delimited at the underside in each case by a smooth end region (34), or has a structure of elevation...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor chip (10) is specified which is, in particular, an optoelectronic semiconductor chip which has a structured substrate (30), which at a surface (31) has a structure of depressions (32) delimited at the underside in each case by a smooth end region (34), or has a structure of elevations (33) delimited at the top side in each case by a smooth end region (34), wherein the end regions (34) are arranged in a manner spaced apart laterally with respect to one another. Furthermore, a method for producing such a semiconductor chip is specified. |
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