Sputtering arrangement for sputtering a material on a substrate surface

Sputtering arrangement for sputtering a material on a substrate surface

A sputtering arrangement for sputtering a material on a substrate surface is provided. The sputtering arrangement includes at least one sputtering cathode having a first end portion and a second end portion, wherein the sputtering cathode extends along a first axis, at least one substrate support co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: DIETER, TORSTEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:A sputtering arrangement for sputtering a material on a substrate surface is provided. The sputtering arrangement includes at least one sputtering cathode having a first end portion and a second end portion, wherein the sputtering cathode extends along a first axis, at least one substrate support configured to support the substrate and arranged opposite the at least one sputtering cathode, wherein the substrate support extends along a second axis, and wherein the second axis forms a first angle with the first axis, and at least one actuation device connectable to the at least one sputtering cathode, particularly to the first end portion and/or the second end portion. The at least one actuation device is configured to change the first angle, particularly during a sputtering process.