Substrate structure and method of manufacture thereof

The invention provides a substrate structure including a first substrate having first and second contacts and a second substrate having third and fourth contacts, the end portion of the first contact being higher than the end portion of the second contact, and the end portion of the fourth contact being higher than the end portion of the third contact for allowing the first and third contacts, and the second and fourth contacts to be respectively oppositely connected with each other and thus stack the first substrate is on the second substrate. By complementary abutment, the joint position of first and third contacts differs from the joint position of second and fourth contacts to prevent bridging therebetween. The invention further provides a method of the manufacturing the package structure as mentioned above.