Package substrate and package member

This invention provides a package substrate and a package member, the package substrate comprises: a lamellar body; a first electrical connection pad, a second electrical connection pad and a third electrical connection pad that are formed on one surface of the lamellar body, each separately sets a conductive bump, the third electrical connection pad is located outside an area between the conductive bumps set by the first electrical connection pad and the second electrical connection pad; and a first conductive blind hole, a second conductive blind hole, a third conductive blind hole, a first internal conductive trace, a second internal conductive trace and a third internal conductive trace formed within the lamellar body, the conductive blind holes enable the electrical connection pads separately connect the internal conductive traces. This invention can avoid conductive bump and conductive trace bridging and avoid conductive bump non-wetting due to solder mask layer.