Substrate structure, manufacturing method thereof, and method for manufacturing an electric device

According to embodiments of the disclosure, a substrate structure, a manufacturing method, and a method for manufacturing an electric device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer is...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, YI-LING, WANG, LIING, CHEN, SIN-AN, CHEN, SHENG-WEI, FU, CHUAN-HSU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	According to embodiments of the disclosure, a substrate structure, a manufacturing method, and a method for manufacturing an electric device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer is in contact with the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the sum of acrylate group of the at least one acrylate-based monomer and the at least one acrylate-based oligomer is greater than or equal to 3. The flexible substrate is covered over and contacted with the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.