Package module with wiring electronic component and method for the same

A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, WEI-HSUAN, LIN, KUANANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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