Package module with wiring electronic component and method for the same

Package module with wiring electronic component and method for the same

A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, WEI-HSUAN, LIN, KUANANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed according to the transformed parameters. The package module at least includes a substrate, the electronic component, and a molding layer. In addition, the transforming step refers to the dielectric constant of the molding layer.