Package module with wiring electronic component and method for the same
A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed...
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creator | LEE, WEI-HSUAN LIN, KUANANG |
description | A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed according to the transformed parameters. The package module at least includes a substrate, the electronic component, and a molding layer. In addition, the transforming step refers to the dielectric constant of the molding layer. |
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Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed according to the transformed parameters. The package module at least includes a substrate, the electronic component, and a molding layer. 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In addition, the transforming step refers to the dielectric constant of the molding layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPSEzOTkxPVcjNTynNSVUozyzJABJFmXnpCqk5qcklRfl5mckKyfm5Bfl5qXklCol5KQq5qSUZ-SkKaflFCiUZqQrFibmpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPiTcyMDQ1MTQzMDE0ZgYNQBjZTPr</recordid><startdate>20151101</startdate><enddate>20151101</enddate><creator>LEE, WEI-HSUAN</creator><creator>LIN, KUANANG</creator><scope>EVB</scope></search><sort><creationdate>20151101</creationdate><title>Package module with wiring electronic component and method for the same</title><author>LEE, WEI-HSUAN ; LIN, KUANANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201541604A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, WEI-HSUAN</creatorcontrib><creatorcontrib>LIN, KUANANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, WEI-HSUAN</au><au>LIN, KUANANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Package module with wiring electronic component and method for the same</title><date>2015-11-01</date><risdate>2015</risdate><abstract>A manufacturing method for a package module with wiring electronic component is provided. Firstly, a plurality of parameters of wiring electronic component is calculating according to the assumption electronic component. Then, the parameters are transformed. After that, the package module is formed according to the transformed parameters. The package module at least includes a substrate, the electronic component, and a molding layer. In addition, the transforming step refers to the dielectric constant of the molding layer.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Package module with wiring electronic component and method for the same |
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