Cutting apparatus

The subject of the present invention is to provide a cutting apparatus, which can avoid the occurrence of poor setting situation caused by forgetting to replace a holding table and so on in combination with the carelessness of operators. The cutting apparatus includes a holding table for holding a w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PHAN, LINH TRUC, TANAKA, KAZUNARI, YAMATO, AIMI, YAGIHARA, MAKOTO, MATSUOKA, SHINTARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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