Cutting apparatus
The subject of the present invention is to provide a cutting apparatus, which can avoid the occurrence of poor setting situation caused by forgetting to replace a holding table and so on in combination with the carelessness of operators. The cutting apparatus includes a holding table for holding a w...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The subject of the present invention is to provide a cutting apparatus, which can avoid the occurrence of poor setting situation caused by forgetting to replace a holding table and so on in combination with the carelessness of operators. The cutting apparatus includes a holding table for holding a wafer, a dimension detection mechanism for detecting the size of the wafer, a cutting mechanism having a conductive cutting tool, and a control mechanism. The control mechanism includes a dimension storage unit for storing the dimension of the holding table, a blade moving unit for enabling the cutting tool to move toward and approach to an upper surface for height position detection, and a relative position detection unit for detecting the relative position of the cutting tool and the holding surface of the holding table. The dimension detection mechanism is used to detect the size of the holding table which is mounted on a table base, so as to complete the setting of the cutting tool based on the size of the detec |
---|