Method of forming a wrap-around contact on a semiconductor device

Method of forming a wrap-around contact on a semiconductor device

Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.

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Bibliographische Detailangaben
Hauptverfasser: LEIB, JEFFREY S, TROEGER, RALPH T, BERGSTROM, DANIEL B
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Techniques and methods related to forming a wrap-around contact on a semiconductor device, and apparatus, system, and mobile platform incorporating such semiconductor devices.