Collet for bonding semiconductor die

Provided is a collet for bonding a semiconductor die. The collet includes a collet holder including a plurality of holder vacuum holes penetrating through the collet holder from an upper surface to a lower surface of the collet holder; and a collet plate coupled to the collet holder, and including a...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LEE, HYANG-EE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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