Collet for bonding semiconductor die
Provided is a collet for bonding a semiconductor die. The collet includes a collet holder including a plurality of holder vacuum holes penetrating through the collet holder from an upper surface to a lower surface of the collet holder; and a collet plate coupled to the collet holder, and including a...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a collet for bonding a semiconductor die. The collet includes a collet holder including a plurality of holder vacuum holes penetrating through the collet holder from an upper surface to a lower surface of the collet holder; and a collet plate coupled to the collet holder, and including at least one plate vacuum hole, the number of which is less than the number of the plurality of holder vacuum holes, wherein the plate vacuum hole is communicated with all of the plurality of holder vacuum holes. |
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