Anode unit and plating apparatus having such anode unit

The present invention provides an anode unit able to form the metal film of uniform thickness on the substrate. Anode unit 2 contains: the anode 3; the first feeding strap 10, which is to contain the first feeding part 11 connecting to the center of anode 3; the second feeding strap 13, which is to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAKADA, TSUTOMU, TSUJINO, JUNICHIRO, YAHAGI, MITSUTOSHI, TAMARI, YUSUKE, OWATARI, AKIRA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides an anode unit able to form the metal film of uniform thickness on the substrate. Anode unit 2 contains: the anode 3; the first feeding strap 10, which is to contain the first feeding part 11 connecting to the center of anode 3; the second feeding strap 13, which is to be disposed onto the central shaft O of anode 3 and contains the second feeding part 15 disposed upon leaving anode 3; a plurality of support arms 14a, which are radially extended from the second feeding part 15, wherein the plural support arms 14a are connected to the outer peripheral part of the anode 3.