Printed circuit board and fabrication thereof

Printed circuit board and fabrication thereof

A printed circuit board is disclosed. An insulating layer comprises a first side and a second side opposite to the first side. A first pad layer is embedded in the insulating layer and neighbors the first side. A second pad layer is disposed on the second side of the insulating layer. A conductive v...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HSU, HUNG-EN, CHU, HAN-MING, LIN, CHENG-HSIENG, YU, SHUN-MING
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A printed circuit board is disclosed. An insulating layer comprises a first side and a second side opposite to the first side. A first pad layer is embedded in the insulating layer and neighbors the first side. A second pad layer is disposed on the second side of the insulating layer. A conductive via is in the insulating layer, and connects the first pad layer and the second pad layer. A plurality of conductive lines are provided, wherein at least one of the conductive lines is on the first side of the insulating layer.