Method and apparatus for adjusting curvature of substrate
The disclosure provides a method for adjusting the curvature of a substrate, including: placing a substrate into a recess of a carrier, wherein the recess has a shoulder, and the substrate is positioned in the shoulder; covering the holding tool with a cover plate having an air hole, wherein the cov...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The disclosure provides a method for adjusting the curvature of a substrate, including: placing a substrate into a recess of a carrier, wherein the recess has a shoulder, and the substrate is positioned in the shoulder; covering the holding tool with a cover plate having an air hole, wherein the cover plate has a protruding fringe corresponding to the shoulder for fixing the substrate; heating the substrate through the holding tool; performing a vacuum suction process through the air hole such that the substrate bends toward the air hole; and cooling the substrate. The present disclosure also provides an apparatus for adjusting the curvature of a substrate. |
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