Electronic device, cover for electronic device and method for manufacturing same

The present invention provides an electronic device, a cover for an electronic device, and a method for manufacturing the cover. The cover includes a main portion and a peripheral portion. The main portion is configured to cover a display region of the electronic device, and the peripheral portion i...

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Bibliographische Detailangaben
Hauptverfasser:	WU, JUIN-MING, LOU, WEING, LU, CHIENIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DEAF-AID SETS DYES ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides an electronic device, a cover for an electronic device, and a method for manufacturing the cover. The cover includes a main portion and a peripheral portion. The main portion is configured to cover a display region of the electronic device, and the peripheral portion is configured to cover a non-display region of the electronic device. The peripheral portion includes a transparent substrate and a plurality of through holes passing through the transparent substrate.