Chip on board light emitting diode and the manufacturing method thereof

A chip on board light emitting diode includes a substrate, a plurality of light emitting diodes, two electrodes, and an encapsulating glue layer without a rim surrounding. The substrate has a die bonding area, and the light emitting diodes are disposed on the die bonding area. The encapsulating glue...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YANG, CHENG-HUNG, WANG, KUN-HSIUNG, CHIANG, CHINGI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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