Chip on board light emitting diode and the manufacturing method thereof
A chip on board light emitting diode includes a substrate, a plurality of light emitting diodes, two electrodes, and an encapsulating glue layer without a rim surrounding. The substrate has a die bonding area, and the light emitting diodes are disposed on the die bonding area. The encapsulating glue...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A chip on board light emitting diode includes a substrate, a plurality of light emitting diodes, two electrodes, and an encapsulating glue layer without a rim surrounding. The substrate has a die bonding area, and the light emitting diodes are disposed on the die bonding area. The encapsulating glue layer covers the light emitting diodes and the die bonding area. |
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