Light emitting module and using the same
A light emitting module includes a first lead frame, a carrier, a first light emitting diode, a first wire, a second wire, a first protection layer, a second protection layer, and an encapsulant. The first lead frame includes a first conductive portion and a second conductive portion apart from each...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A light emitting module includes a first lead frame, a carrier, a first light emitting diode, a first wire, a second wire, a first protection layer, a second protection layer, and an encapsulant. The first lead frame includes a first conductive portion and a second conductive portion apart from each other. The second conductive portion has a die-bonding area. The carrier covers a portion of the first lead frame, and forms a cavity exposing the die-bonding area. A front side of the first light emitting diode has a first electrode and a second electrode apart from each other, and the back side of the first light emitting diode is fixed on the die-bonding area. The first wire is electrically connected between the first conductive portion and the first electrode, and the second wire is electrically connected between the second conductive portion and the second electrode. The first protection layer and the second protection layer cover the first wire and the second wire, respectively. The encapsulant is filled in |
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