Anneal module for semiconductor wafers

Anneal module for semiconductor wafers

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500 DEG C processes. The anneal module may include a process chamber formed in a metal body having internal cooling line...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOORE, ROBERT B, FRANCISCHETTI, VINCENT STEFFAN, HANSON, KYLE M, WIRTH, PAUL, WILSON, GREGORY J
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500 DEG C processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.