Linear high-electron mobility transistor
Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device includes a gallium nitride (GaN) buffer layer formed on a substrate, an aluminum gallium nitride (AlGaN) layer formed on the GaN buffer layer, and an indium aluminum n...
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Sprache: | chi ; eng |
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Zusammenfassung: | Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device includes a gallium nitride (GaN) buffer layer formed on a substrate, an aluminum gallium nitride (AlGaN) layer formed on the GaN buffer layer, and an indium aluminum nitride barrier layer formed on the AlGaN layer. Other embodiments may also be described and/or claimed. |
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