Probe test device

A probe test device is provided, adapted to detect a plurality of integrated circuit chips of wafer under test. On the wafer under test is provided with a plurality of cutting road, and on the cutting road provided with a plurality of anti-EMI grounding pad. The probe test device includes a plurality of the first probe and a plurality of the second probe, the first probe is used in conjunction with a plurality of first pad on the integrated circuit chips. The first probe includes a plurality of first signal probe and the plurality of first ground probe, the first signal probe is used to connect with the first signal pad, and the first ground probe is used to connect with the first ground pad. The second probe is used to connect with the anti-EMI grounding pad, the second probe is electrically connected to a ground potential.