Dicing sheet with protective film forming layer and chip fabrication method

Dicing sheet with protective film forming layer and chip fabrication method

To provide a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformity and excellent printing accuracy, and that is expandable and uses a heat resistant substrate material.

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Bibliographische Detailangaben
Hauptverfasser: TAKANO, KEN, SHINODA, TOMONORI, FURUDATE, MASAAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:To provide a dicing sheet with a protective film forming layer that makes it possible to easily fabricate a semiconductor chip having a protective film with high film thickness uniformity and excellent printing accuracy, and that is expandable and uses a heat resistant substrate material.