Lead frame for mounting semiconductor element, and manufacturing method therefor
To provide a lead frame for mounting a semiconductor element satisfying adhesion between the mounting part and the terminal part of the semiconductor element and a sealing resin. On the side face of the semiconductor element mounting part and/or the terminal part of the lead frame, a protrusion part...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | To provide a lead frame for mounting a semiconductor element satisfying adhesion between the mounting part and the terminal part of the semiconductor element and a sealing resin. On the side face of the semiconductor element mounting part and/or the terminal part of the lead frame, a protrusion part 4 protruding from the top and the bottom face of the semiconductor element mounting part and/or the terminal part is included. A tip part 5 of the protrusion part 4 is substantially flat or of an arcuate shape with a large thickness. |
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