Substrate having excellent thermal conductivity in thickness direction, light emitting diode element comprising the substrate and method of manufacturing the substrate
The present invention relates to a substrate having an excellent thermal conductivity in the thickness direction and made of a metal matrix composite material, and a light emitting diode device having the substrate. The light emitting diode device according to the present invention comprises a condu...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to a substrate having an excellent thermal conductivity in the thickness direction and made of a metal matrix composite material, and a light emitting diode device having the substrate. The light emitting diode device according to the present invention comprises a conductive support substrate, and a first conductor layer, an active layer, and a second conductor layer, which are sequentially formed on the upper surface of the conductive support substrate, wherein the conductive support substrate has a tissue in which carbon particles are aligned in parallel to the thickness direction of the support substrate on the metal matrix. |
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