Semiconductor structure and method of manufacture

Disclosed is a method of manufacturing a semiconductor structure, including providing a substrate body composed of a plurality of medium boards, the substrate having opposing medium side and die-mounting side and a plurality of conductive via holes interconnecting the medium side and the die-mounting side; and performing a cutting process to cut and separate the medium boards in a direction from the medium side to the die-mounting side, thereby eliminating the need to form insulating encapsulants as in prior techniques which can avoid residuals remaining on the surface of the medium boards and also the manufacturing process can be simplified to achieve cost reduction.