Thermosensitive adhesive

A thermosensitive adhesive of the present invention comprises: a side chain-crystalline polymer having a melting point of 20 to 30DEG C obtained by adding a metal chelating compound into the following copolymer with the following addition amount (A) followed by crosslinking reaction, and a tackifyin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAGAO, AYUMI, KAWAHARA, SHINICHIRO, YAMASHITA, KOJI, NANCHI, MINORU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A thermosensitive adhesive of the present invention comprises: a side chain-crystalline polymer having a melting point of 20 to 30DEG C obtained by adding a metal chelating compound into the following copolymer with the following addition amount (A) followed by crosslinking reaction, and a tackifying agent, and which as decreased adhesive force at temperatures lower than the melting temperature. Copolymer: polymerized by: 25 to 30 parts by weight of a (meth)acrylic having a linear alkyl group with a carbon number of 16 to 22, 60 to 65 parts by weight of a (meth)acrylic having an alkyl group with a carbon number of 1 to 6, 1 to 10 parts by weight of a polar monomer, and 1 to 10 parts by weight of a reactive fluorine compound. Addition amount (A): 3 to 10 parts by weight with respect to 100 parts by weight of the copolymer.