Device for dispensing adhesive on a substrate

A device for dispensing adhesive on a substrate comprises a writing head (1) with a first dispensing nozzle (4) and at least one second dispensing nozzle (6). The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GRUETER, RUEDI, KOSTER, CHRISTOF, STADLER, PAUL ANDREAS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NOZZLES PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A device for dispensing adhesive on a substrate comprises a writing head (1) with a first dispensing nozzle (4) and at least one second dispensing nozzle (6). The device can be operated in two operating modes and is configured to perform the following steps for the change from the one operating mode to the other operating mode: - lifting of the writing head (1), - retracting or extending a pin (22), and - lowering of the writing head (1) to a predetermined working altitude, wherein the tips of the dispensing nozzles (4, 6) reach a substantially similar altitude above the substrate in the retracted state of the pin (22), and wherein the tip of the at least one second dispensing nozzle (6) reaches a higher altitude above the substrate than the tip of the first dispensing nozzle (4) in the extended state of the pin (22).