$A mold for partial surface treatment of secondary optics lens on light-emitting diodes or condenser or refraction lens on solar cell$

A mold for partial surface treatment of secondary optics lens on light-emitting diodes or condenser or refraction lens on solar cell

There is provided a mold which is used for a local surface treatment of secondary optics lens on light-emitting diodes or condenser or refraction lens on solar cell. The meld limits sample for a specific treated area. The treatment of electrolysis, electro-polishing, electro-deposition, anodization,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUN, CHIEN-WAN, YANG, HIS-WEN, CHEN, CHIENON, LIN, JIN-SHYONG, CHEN, CHIH-YUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	There is provided a mold which is used for a local surface treatment of secondary optics lens on light-emitting diodes or condenser or refraction lens on solar cell. The meld limits sample for a specific treated area. The treatment of electrolysis, electro-polishing, electro-deposition, anodization, etching, chemical deposition, and vapor-deposition can be approached on a specific sample area when sample under this mold. The mold structure including: conductive wire, silicone tube; conductive wire waterproof cover; conductive wire waterproof seat; conductive wire waterproof scat O-ring; conductive rod; mold bottom set; mole bottom O-ring; conductive sheet; top mold waterproof; work samples; top mole; samples of the reaction area.