Method and apparatus for purging and plasma suppression in a process chamber

Method and apparatus for purging and plasma suppression in a process chamber

A substrate processing system includes a showerhead that comprises a head portion and a stem portion and that delivers precursor gas to a processing chamber. A baffle includes a base portion having an outer diameter that is greater than an outer diameter of the head portion of the showerhead, that c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUBRAMONIUM, PRAMOD, BREILING, PATRICK, O'LOUGHLIN, JENNIFER, SHANKAR, NAGRAJ, GERBER, KEVIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
NOZZLES
PERFORMING OPERATIONS
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Beschreibung
Zusammenfassung:A substrate processing system includes a showerhead that comprises a head portion and a stem portion and that delivers precursor gas to a processing chamber. A baffle includes a base portion having an outer diameter that is greater than an outer diameter of the head portion of the showerhead, that comprises a dielectric material and that is arranged between the head portion of the showerhead and an upper surface of the processing chamber.