Heat-dissipating assembly structure

A heat-dissipating assembly structure includes a circuit board, a heat source, a first heat-dissipating element, a second heat-dissipating element, a first heat-dissipating medium, and a second heat-dissipating medium. The circuit board has a first main surface and a second main surface opposite to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEN, HSIN-EN, LIU, HSIANGAO, TSAI, SHENG-HUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!