Heat-dissipating assembly structure

A heat-dissipating assembly structure includes a circuit board, a heat source, a first heat-dissipating element, a second heat-dissipating element, a first heat-dissipating medium, and a second heat-dissipating medium. The circuit board has a first main surface and a second main surface opposite to...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, HSIN-EN, LIU, HSIANGAO, TSAI, SHENG-HUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS
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Beschreibung
Zusammenfassung:	A heat-dissipating assembly structure includes a circuit board, a heat source, a first heat-dissipating element, a second heat-dissipating element, a first heat-dissipating medium, and a second heat-dissipating medium. The circuit board has a first main surface and a second main surface opposite to each other and a plurality of through holes. The heat source is fixed on the first main surface of the circuit board. The first heat-dissipating element is disposed on the first main surface of the circuit board, and the first heat-dissipating element includes a plurality of first coupling portions. The second heat-dissipating element is disposed on the second main surface of the circuit board, and the second heat-dissipating element includes a plurality of second coupling portions. Each of the first coupling portions and one of the second coupling portions constitute a coupling structure by coupling to each other, and the coupling structures respectively threads the through holes of the circuit board. The first he