Laminate, method for producing laminate and multilayer substrate

Provided is a laminate wherein the bonding strength between a cured product and a metal layer is increased. A laminate (1) according to the present invention is provided with: a cured product (2) that is obtained by curing an epoxy resin material which contains an epoxy resin, a curing agent and an...

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Bibliographische Detailangaben
Hauptverfasser:	KATAGIRI, TOMOAKI, SHIRAHASE, KAZUTAKA, KUNIKAWA, TOMOKI, TANAKA, TERUHISA, YOKOTA, REONA, MORI, NOBUHIRO, HAYASHI, TATSUSHI, TANAKA, TOSHIAKI, TOTTORI, DAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a laminate wherein the bonding strength between a cured product and a metal layer is increased. A laminate (1) according to the present invention is provided with: a cured product (2) that is obtained by curing an epoxy resin material which contains an epoxy resin, a curing agent and an inorganic filler; and a metal layer (3) that is laminated on the surface of the cured product (2). Parts of the metal layer (3) are embedded in the cured product (2) in a plurality of positions, and the maximum depth among all the depths of the plurality of metal layer parts (3a-3d) embedded in the cured product (2) is 0.5 [mu]m or more, while the maximum interval among all the intervals of the plurality of metal layer parts (3a-3d) embedded in the cured product (2) is 0.5 [mu]m or more.