Semiconductor package and method of manufacture

Disclosed is a semiconductor package, including a substrate having a circuit formed thereon, an insulating layer covering the circuit, a conductive layer formed on the insulating layer and a semiconductor element formed on the substrate, wherein the substrate further includes a switching pad and a f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, PANGUN, CHENG, XIE-REN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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