Semiconductor package and method of manufacture

Disclosed is a semiconductor package, including a substrate having a circuit formed thereon, an insulating layer covering the circuit, a conductive layer formed on the insulating layer and a semiconductor element formed on the substrate, wherein the substrate further includes a switching pad and a first electrical contact pad for allowing the circuit to be disposed between the switching pad and the contact pad, and the conductive layer extends to the switching pad and the contact pad, and the semiconductor element is connected to the switching pad via a plurality of solder wires. The conductive layer is used to replace the conventional short solder wires to connect the switching pad and the first electrical contact pad to reduce the use of solder wires and the resultant short circuit problem due to the contact with solder wires. The invention further provides a method for producing the semiconductor package as described above.