Conductive fine particles
Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especial...
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creator | OHNO, AYANO ASANO, ITARU TAKEZAKI, HIROSHI |
description | Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especially in cases where the conductive fine particles have a deformation recovery rate (SR) within the range of 0.1-13% under a load of 9.8 mN, a particle diameter distribution index of 1-3 and a particle diameter within the range of 0.1-100 [mu]m, the conductive fine particles exhibit excellent connection reliability in applications such as conductive adhesives for flexible boards. |
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The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especially in cases where the conductive fine particles have a deformation recovery rate (SR) within the range of 0.1-13% under a load of 9.8 mN, a particle diameter distribution index of 1-3 and a particle diameter within the range of 0.1-100 [mu]m, the conductive fine particles exhibit excellent connection reliability in applications such as conductive adhesives for flexible boards.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140916&DB=EPODOC&CC=TW&NR=201435913A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140916&DB=EPODOC&CC=TW&NR=201435913A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OHNO, AYANO</creatorcontrib><creatorcontrib>ASANO, ITARU</creatorcontrib><creatorcontrib>TAKEZAKI, HIROSHI</creatorcontrib><title>Conductive fine particles</title><description>Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especially in cases where the conductive fine particles have a deformation recovery rate (SR) within the range of 0.1-13% under a load of 9.8 mN, a particle diameter distribution index of 1-3 and a particle diameter within the range of 0.1-100 [mu]m, the conductive fine particles exhibit excellent connection reliability in applications such as conductive adhesives for flexible boards.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB0zs9LKU0uySxLVUjLzEtVKEgsKslMzkkt5mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgaGJsamlobGjsbEqAEALqgi6Q</recordid><startdate>20140916</startdate><enddate>20140916</enddate><creator>OHNO, AYANO</creator><creator>ASANO, ITARU</creator><creator>TAKEZAKI, HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20140916</creationdate><title>Conductive fine particles</title><author>OHNO, AYANO ; ASANO, ITARU ; TAKEZAKI, HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201435913A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><toplevel>online_resources</toplevel><creatorcontrib>OHNO, AYANO</creatorcontrib><creatorcontrib>ASANO, ITARU</creatorcontrib><creatorcontrib>TAKEZAKI, HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OHNO, AYANO</au><au>ASANO, ITARU</au><au>TAKEZAKI, HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Conductive fine particles</title><date>2014-09-16</date><risdate>2014</risdate><abstract>Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especially in cases where the conductive fine particles have a deformation recovery rate (SR) within the range of 0.1-13% under a load of 9.8 mN, a particle diameter distribution index of 1-3 and a particle diameter within the range of 0.1-100 [mu]m, the conductive fine particles exhibit excellent connection reliability in applications such as conductive adhesives for flexible boards.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES |
title | Conductive fine particles |
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