Conductive fine particles
Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especial...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | Conductive fine particles, each of which is composed of a fine polymer particle and a conductive layer that is formed by coating the surface of the fine polymer particle with a metal. The conductive fine particles have an elastic modulus (E) at 5% displacement within the range of 1-100 MPa. Especially in cases where the conductive fine particles have a deformation recovery rate (SR) within the range of 0.1-13% under a load of 9.8 mN, a particle diameter distribution index of 1-3 and a particle diameter within the range of 0.1-100 [mu]m, the conductive fine particles exhibit excellent connection reliability in applications such as conductive adhesives for flexible boards. |
|---|