Component assembly using a temporary attach material

A method (100) of attaching a die (12) to a carrier (14) using a temporary attach material (20) is disclosed. The method (100) comprises attaching the temporary attach material (20) between a surface of the die (12) and a surface of the carrier (14). The temporary attach material (20) attaches the d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	COOKSON, TERRY LEE MARVIN, GAMAGE, SISIRA KANKANAM, LOGAN, ELIZABETH ANNE, HOLLIS, RONALD ALMY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A method (100) of attaching a die (12) to a carrier (14) using a temporary attach material (20) is disclosed. The method (100) comprises attaching the temporary attach material (20) between a surface of the die (12) and a surface of the carrier (14). The temporary attach material (20) attaches the die (12) to the carrier (14). The method (100) comprises bonding at least one connector (36) to the die (12) and the carrier (14). The connector (36) includes a first end (38) bonded to the carrier (14) and a second end (40) bonded to the die (12). The method (100) further comprises encapsulating at least a portion of the die (12) and at least a portion of the at least one connector (36) by an encapsulation material (44).