Connection system

This disclosure relates to connection systems for fluid connections. Even more particularly, some embodiments this disclosure relate to connection systems for deformable materials. Even more particularly, some embodiments relate to fluid connections for use with semiconductor manufacturing fluids. E...

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Bibliographische Detailangaben
Hauptverfasser:	PUGLIA, JOHN P, NIERMEYER, J. KARL, MADHAVARAM, KALYAN, LEE, BEN MAI PAK, MENN, DMITRI, LAVERDIERE, MARC, MARTLAND, CRAIG WALLACE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING JOINTS OR FITTINGS FOR PIPES LIGHTING MEANS FOR THERMAL INSULATION IN GENERAL MECHANICAL ENGINEERING PIPES SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	This disclosure relates to connection systems for fluid connections. Even more particularly, some embodiments this disclosure relate to connection systems for deformable materials. Even more particularly, some embodiments relate to fluid connections for use with semiconductor manufacturing fluids. Embodiments provide a connection system that may use a connection nut that creates 360 degrees of threaded engagement with less than 360 degrees of rotation. Embodiments further provide connection systems that can seal multiple ports simultaneously.