Lighting module and manufacturing method thereof

A lighting module includes a first conductive frame, a second conductive frame physically separated from the first conductive frame, a protective plastic layer, a reflective plastic layer, and a lighting die. The protective plastic layer surrounds the first and second conductive frames, and an accommodating space is defined to expose an inner surface of the first and second conductive frames. The accommodating space further includes a die-bonding region. The reflective plastic layer is formed on the inner surface in the accommodating space. The lighting die is located on the die-bonding region, and electrically connected to the first and second conductive frames. The lighting die protrudes the reflective plastic layer.