Double plate for pressing substrate and method for pressing substrate

Disclosed herein are a double plate for pressing a substrate and a method for pressing the substrate. According to an exemplary embodiment of the present invention, there is provided a double plate for pressing a substrate, the double plate including: a first plate; a second plate having a coefficie...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, HO-SHIK, PARK, JONG-TAE, SEO, DEA-SEOK, KIM, GYOU-NAM, EUN, SANG-IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Disclosed herein are a double plate for pressing a substrate and a method for pressing the substrate. According to an exemplary embodiment of the present invention, there is provided a double plate for pressing a substrate, the double plate including: a first plate; a second plate having a coefficient of thermal expansion different from that of the first plate; and an adhesive layer adhering the first and second plates between the first plate and the second plate and buffering an effect on each other caused by thermal expansion of each of the first and second plates, wherein the double plate for pressing a substrate is interposed between the plurality of substrates at the time of pressing the plurality of substrates. In addition, there is provided a method for pressing the substrate using the same.