Chip stacking structure

A chip stacking structure including a plurality of microbump structures, at least one first space layer, a plurality of first substrates, a plurality of second substrates and at least one second space layer is provided. The first substrates are stacked on one another by using a part of the microbump...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YU, HSUN, WU, SHIH-HSIEN, CHEN, PENG-SHU, LIU, CHANGIH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!