Chip ejection device

Chip ejection device

A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second push...

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1. Verfasser: LEE, WEI-TA
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE, WEI-TA
description A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second pushing module comprises a second pushing member and a second transmission member which pushing the second pushing member, the third pushing module comprises a third pushing member and a third transmission member which pushes the first pushing member. The first pushing member, the second pushing module and the third pushing member three-segmented separate the chip from the wafer, to avoid breaking the chip.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201426892A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201426892A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201426892A3</originalsourceid><addsrcrecordid>eNrjZBBxzsgsUEjNSk0uyczPU0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGhiZGZhaWRo7GxKgBADlXILg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip ejection device</title><source>esp@cenet</source><creator>LEE, WEI-TA</creator><creatorcontrib>LEE, WEI-TA</creatorcontrib><description>A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second pushing module comprises a second pushing member and a second transmission member which pushing the second pushing member, the third pushing module comprises a third pushing member and a third transmission member which pushes the first pushing member. The first pushing member, the second pushing module and the third pushing member three-segmented separate the chip from the wafer, to avoid breaking the chip.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140701&amp;DB=EPODOC&amp;CC=TW&amp;NR=201426892A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140701&amp;DB=EPODOC&amp;CC=TW&amp;NR=201426892A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, WEI-TA</creatorcontrib><title>Chip ejection device</title><description>A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second pushing module comprises a second pushing member and a second transmission member which pushing the second pushing member, the third pushing module comprises a third pushing member and a third transmission member which pushes the first pushing member. The first pushing member, the second pushing module and the third pushing member three-segmented separate the chip from the wafer, to avoid breaking the chip.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxzsgsUEjNSk0uyczPU0hJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGhiZGZhaWRo7GxKgBADlXILg</recordid><startdate>20140701</startdate><enddate>20140701</enddate><creator>LEE, WEI-TA</creator><scope>EVB</scope></search><sort><creationdate>20140701</creationdate><title>Chip ejection device</title><author>LEE, WEI-TA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201426892A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, WEI-TA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, WEI-TA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip ejection device</title><date>2014-07-01</date><risdate>2014</risdate><abstract>A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second pushing module comprises a second pushing member and a second transmission member which pushing the second pushing member, the third pushing module comprises a third pushing member and a third transmission member which pushes the first pushing member. The first pushing member, the second pushing module and the third pushing member three-segmented separate the chip from the wafer, to avoid breaking the chip.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip ejection device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T00%3A10%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20WEI-TA&rft.date=2014-07-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201426892A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true