Chip ejection device

A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second push...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	LEE, WEI-TA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A chip ejection device includes a base, a first pushing module, a second pushing module, and a third pushing module. The base comprises a pushing surface, the first pushing module comprises a first pushing member and a first transmission member which pushing the first pushing member, the second pushing module comprises a second pushing member and a second transmission member which pushing the second pushing member, the third pushing module comprises a third pushing member and a third transmission member which pushes the first pushing member. The first pushing member, the second pushing module and the third pushing member three-segmented separate the chip from the wafer, to avoid breaking the chip.