Manufacturing method of electronic device member and electronic device, and electronic device member

To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate. A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair of laminates are laminated with...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MITANI, SHINJO, NITO, MANABU, UTSUGI, HIROSHI, ITO, YASUNORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	To manufacture an electronic device member which suppresses detachment of a seal material and damage of a substrate. A manufacturing method of an electronic device member includes a lamination step, a curing step, and a detachment step. In the lamination step, a pair of laminates are laminated with a first seal material and a second seal material interposed therebetween under reduced pressure. The pair of laminates comprise: a substrate having one or more element formation regions on which an electronic device is formed; and a reinforcement plate detachably bonded to the substrate. The first seal material is arranged in a periphery of the element formation region. The second seal material is arranged outside an aggregation region of the first seal material and has a frame-like shape. The curing step causes the first seal material and the second seal material to cure. The detachment step detaches the reinforcement plate from the substrate.